Monocrystalline beta-phase gallium oxide (β-Ga_(2)O_(3)) is a promising ultrawide bandgap semiconductor material. However, the deformation mechanism in ultraprecision machining has not yet been revealed. The aim of t...Monocrystalline beta-phase gallium oxide (β-Ga_(2)O_(3)) is a promising ultrawide bandgap semiconductor material. However, the deformation mechanism in ultraprecision machining has not yet been revealed. The aim of this study is to investigate the damage pattern and formation mechanism of monocrystalline β-Ga_(2)O_(3)in different grinding processes. Transmission electron microscopy was used to observe the subsurface damage in rough, fine, and ultrafine grinding processes. Nanocrystals and stacking faults existed in all three processes, dislocations and twins were observed in the rough and fine grinding processes, cracks were also observed in the rough grinding process, and amorphous phase were only present in the ultrafine grinding process. The subsurface damage thickness of the samples decreased with the reduction in the grit radius and the grit depth of cut. Subsurface damage models for grinding process were established on the basis of the grinding principle, revealing the mechanism of the mechanical effect of grits on the damage pattern. The formation of nanocrystals and amorphous phase was related to the grinding conditions and material characteristics. It is important to investigate the ultraprecision grinding process of monocrystalline β-Ga_(2)O_(3). The results in this work are supposed to provide guidance for the damage control of monocrystalline β-Ga_(2)O_(3)grinding process.展开更多
基金the National Natural Science Foundation of China(Grant Nos.51975091,51991372,and 51735004)the National Key R&D Program of China(Grant No.2018YFB1201804-1)+1 种基金the Lab of Space Optoelectronic Measurement&Perception(LabSOMP-2019-05)Jiangsu Key Laboratory of Precision and Micro-Manufacturing Technology.
文摘Monocrystalline beta-phase gallium oxide (β-Ga_(2)O_(3)) is a promising ultrawide bandgap semiconductor material. However, the deformation mechanism in ultraprecision machining has not yet been revealed. The aim of this study is to investigate the damage pattern and formation mechanism of monocrystalline β-Ga_(2)O_(3)in different grinding processes. Transmission electron microscopy was used to observe the subsurface damage in rough, fine, and ultrafine grinding processes. Nanocrystals and stacking faults existed in all three processes, dislocations and twins were observed in the rough and fine grinding processes, cracks were also observed in the rough grinding process, and amorphous phase were only present in the ultrafine grinding process. The subsurface damage thickness of the samples decreased with the reduction in the grit radius and the grit depth of cut. Subsurface damage models for grinding process were established on the basis of the grinding principle, revealing the mechanism of the mechanical effect of grits on the damage pattern. The formation of nanocrystals and amorphous phase was related to the grinding conditions and material characteristics. It is important to investigate the ultraprecision grinding process of monocrystalline β-Ga_(2)O_(3). The results in this work are supposed to provide guidance for the damage control of monocrystalline β-Ga_(2)O_(3)grinding process.
