Positive type photosensitive polyimide is used as the modification layer in the thin film transistors production process. The photosensitive polyimide is not only used as the second insulating layer, it can also be us...Positive type photosensitive polyimide is used as the modification layer in the thin film transistors production process. The photosensitive polyimide is not only used as the second insulating layer, it can also be used instead of a mask because of the photosensitivity. A suitable curing condition can help photosensitive polyimide form the high performance polyimide with orderly texture inside, and the performance of imidization depends on the precise control of temperature, time, and heat control during the curing process. Therefore, experiments of different stepped up heating tests are made, and the ability of protecting silicon dioxide is analyzed.展开更多
Photosensitive polyimide precursor containing glycol monocinnamate group was synthesized by a new method. The photoresist, made from the above polyimide precursor, was spin coated onto silicon wafers, prebaked...Photosensitive polyimide precursor containing glycol monocinnamate group was synthesized by a new method. The photoresist, made from the above polyimide precursor, was spin coated onto silicon wafers, prebaked and then exposed to UV light. The appropriate conditions of the photolithographic procedures were determined. This photosensitive polyimide precursor showed good light sensitivity and the polyimide which was obtained by heating the polyimide precursor had a high thermal stability.展开更多
文摘Positive type photosensitive polyimide is used as the modification layer in the thin film transistors production process. The photosensitive polyimide is not only used as the second insulating layer, it can also be used instead of a mask because of the photosensitivity. A suitable curing condition can help photosensitive polyimide form the high performance polyimide with orderly texture inside, and the performance of imidization depends on the precise control of temperature, time, and heat control during the curing process. Therefore, experiments of different stepped up heating tests are made, and the ability of protecting silicon dioxide is analyzed.
文摘Photosensitive polyimide precursor containing glycol monocinnamate group was synthesized by a new method. The photoresist, made from the above polyimide precursor, was spin coated onto silicon wafers, prebaked and then exposed to UV light. The appropriate conditions of the photolithographic procedures were determined. This photosensitive polyimide precursor showed good light sensitivity and the polyimide which was obtained by heating the polyimide precursor had a high thermal stability.
