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Belief reliability:a scientific exploration of reliability engineering
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作者 ZHANG Qingyuan LI Xiaoyang +1 位作者 ZU Tianpei KANG Rui 《Journal of Systems Engineering and Electronics》 SCIE CSCD 2024年第3期619-643,共25页
This paper systematically introduces and reviews a scientific exploration of reliability called the belief reliability.Beginning with the origin of reliability engineering,the problems of present theories for reliabil... This paper systematically introduces and reviews a scientific exploration of reliability called the belief reliability.Beginning with the origin of reliability engineering,the problems of present theories for reliability engineering are summarized as a query,a dilemma,and a puzzle.Then,through philosophical reflection,we introduce the theoretical solutions given by belief reliability theory,including scientific principles,basic equations,reliability science experiments,and mathematical measures.The basic methods and technologies of belief reliability,namely,belief reliability analysis,function-oriented belief reliability design,belief reliability evaluation,and several newly developed methods and technologies are sequentially elaborated and overviewed.Based on the above investigations,we summarize the significance of belief reliability theory and make some prospects about future research,aiming to promote the development of reliability science and engineering. 展开更多
关键词 belief reliability performance margin reliability experiment chance measure UNCERTAINTY
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QUICK ASSESSMENT METHODOLOGY FOR RELIABILITY OF SOLDER JOINTS IN BALL GRID ARRAY(BGA)ASSEMBLY——PART Ⅱ:RELIABILITY EXPERIMENT AND NUMERICAL SIMULATION 被引量:1
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作者 史训清 John HL Pang +2 位作者 杨前进 王志平 聂景旭 《Acta Mechanica Sinica》 SCIE EI CAS CSCD 2002年第4期356-367,共12页
In the present study,a facility,i.e.,a mechanical deflection system (MDS),was established and applied to assess the long-term reliability of the solder joints in plastic ball grid array (BGA) assembly.It was found tha... In the present study,a facility,i.e.,a mechanical deflection system (MDS),was established and applied to assess the long-term reliability of the solder joints in plastic ball grid array (BGA) assembly.It was found that the MDS not only quickly assesses the long-term reliability of solder joints within days,but can also mimic similar failure mechanisms in accelerated thermal cycling (ATC) tests. Based on the MDS and ATC reliability experiments,the acceleration factors (AF) were obtained for different reliability testing conditions.Furthermore,by using the creep constitutive relation and fatigue life model developed in part I,a numerical approach was established for the purpose of virtual life prediction of solder joints. The simulation results were found to be in good agreement with the test results from the MDS.As a result,a new reliability assessment methodology was established as an alternative to ATC for the evaluation of long-term reliability of plastic BGA assembly. 展开更多
关键词 long-term reliability plastic BGA assembly MDS reliability experiment FE numerical simulation acceleration factor
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