In this work,the wettability,aging and shear properties of a new type of lead-free solder paste Sn-07Ag-05Cu +BiNi(SACBN07) was investigated by conducting a series of comparison experiments with SAC305 and SAC0307 sol...In this work,the wettability,aging and shear properties of a new type of lead-free solder paste Sn-07Ag-05Cu +BiNi(SACBN07) was investigated by conducting a series of comparison experiments with SAC305 and SAC0307 solder paste.The results show that wettability of SACBN07 is almost equal to SAC305,and better than that of SAC0307 solder paste. The thickness of intermetallic compound( IMC) layer in SACBN07/Cu is lower than that of other two types of solder joint after aging. And Cu_3 Sn layer of SACBN07/Cu is thinner than that of SAC305 and SAC0307. In addition,the SACBN07 solder joints perform the best shear strength among these three types of solder pastes.展开更多
Solder paste quality can be improved from microstructure and surface status of the solder powder.In this work,the micro-morphology of solder paste was observed and the particle surface condition was analyzed.Also,the ...Solder paste quality can be improved from microstructure and surface status of the solder powder.In this work,the micro-morphology of solder paste was observed and the particle surface condition was analyzed.Also,the conditions of corrosion and the corrosion products in different organic acid groups(activators)were analyzed.The result shows that the SnO passive film on the solder powder surface reacts with the COO-in the active agent of the solder paste.This reaction led the passivation layer to be peeled off.It also caused the change in solder powders’physical and chemical properties and made the metal boundary to be cold-welded.This is the root cause of solder paste exsiccation and deterioration.The study on the details shows that to obtain high-quality solder paste,one of the key methods is using the solder powder with ideal passivation shell structure and defect-free surface.展开更多
基金supported by National Natural Science Foundation of China(Grant No.51174069)
文摘In this work,the wettability,aging and shear properties of a new type of lead-free solder paste Sn-07Ag-05Cu +BiNi(SACBN07) was investigated by conducting a series of comparison experiments with SAC305 and SAC0307 solder paste.The results show that wettability of SACBN07 is almost equal to SAC305,and better than that of SAC0307 solder paste. The thickness of intermetallic compound( IMC) layer in SACBN07/Cu is lower than that of other two types of solder joint after aging. And Cu_3 Sn layer of SACBN07/Cu is thinner than that of SAC305 and SAC0307. In addition,the SACBN07 solder joints perform the best shear strength among these three types of solder pastes.
基金financially supported by National Key R&D Program of China(No.2017YFB0305700)。
文摘Solder paste quality can be improved from microstructure and surface status of the solder powder.In this work,the micro-morphology of solder paste was observed and the particle surface condition was analyzed.Also,the conditions of corrosion and the corrosion products in different organic acid groups(activators)were analyzed.The result shows that the SnO passive film on the solder powder surface reacts with the COO-in the active agent of the solder paste.This reaction led the passivation layer to be peeled off.It also caused the change in solder powders’physical and chemical properties and made the metal boundary to be cold-welded.This is the root cause of solder paste exsiccation and deterioration.The study on the details shows that to obtain high-quality solder paste,one of the key methods is using the solder powder with ideal passivation shell structure and defect-free surface.
