The corrosion and leaching behaviors of Sn-0.75Cu solders and joints in NaCl-Na2SO4 and NaCl-Na2SO4-Na2CO3 simulated soil solutions were investigated compared with those in NaCl solution, aiming to assess the potentia...The corrosion and leaching behaviors of Sn-0.75Cu solders and joints in NaCl-Na2SO4 and NaCl-Na2SO4-Na2CO3 simulated soil solutions were investigated compared with those in NaCl solution, aiming to assess the potential risk from the electronic-waste disposed in soil. The leaching kinetics of Sn reveals that the leaching amount of Sn increases with increasing the time. The amount of Sn leached from the joint is the largest in NaCl solution.SO4^2- and CO3^2- inhibit the leaching of Sn from the joints, but accelerate that from the solders. Meanwhile, the corrosion layer of the joint in NaCl solution is more porous, and those immersed in NaCl-Na2SO4 and NaCl-Na2SO4-Na2CO3 solutions are compact. The XRD results indicate that the main corrosion products on the solders and joints surfaces are comprised of tin oxide, tin chloride and tin chloride hydroxide. The potentiodynamic polarization measurements for the solders were discussed in the simulated soil solutions.展开更多
基金Project(2012FY113000)supported by the National Science and Technology Basic Project of the Ministry of Science and Technology of ChinaProjects(51171037+2 种基金5113401351101024)supported by the National Natural Science Foundation of ChinaProject(14B430009)supported by the Science Research Fund of Education Department of Henan Province,China
文摘The corrosion and leaching behaviors of Sn-0.75Cu solders and joints in NaCl-Na2SO4 and NaCl-Na2SO4-Na2CO3 simulated soil solutions were investigated compared with those in NaCl solution, aiming to assess the potential risk from the electronic-waste disposed in soil. The leaching kinetics of Sn reveals that the leaching amount of Sn increases with increasing the time. The amount of Sn leached from the joint is the largest in NaCl solution.SO4^2- and CO3^2- inhibit the leaching of Sn from the joints, but accelerate that from the solders. Meanwhile, the corrosion layer of the joint in NaCl solution is more porous, and those immersed in NaCl-Na2SO4 and NaCl-Na2SO4-Na2CO3 solutions are compact. The XRD results indicate that the main corrosion products on the solders and joints surfaces are comprised of tin oxide, tin chloride and tin chloride hydroxide. The potentiodynamic polarization measurements for the solders were discussed in the simulated soil solutions.
