The popularization of portable,implantable and wearable microelectronics has greatly stimulated the rapid development of high-power planar micro-supercapacitors(PMSCs).Particularly,the introduction of new functionalit...The popularization of portable,implantable and wearable microelectronics has greatly stimulated the rapid development of high-power planar micro-supercapacitors(PMSCs).Particularly,the introduction of new functionalities(e.g.,high voltage,flexibility,stretchability,self-healing,electrochromism and photo/thermal response)to PMSCs is essential for building multifunctional PMSCs and their smart selfpowered integrated microsystems.In this review,we summarized the latest advances in PMSCs from various functional microdevices to their smart integrated microsystems.Primarily,the functionalities of PMSCs are characterized by three major factors to emphasize their electrochemical behavior and unique scope of application.These include but are not limited to high-voltage outputs(realized through asymmetric configuration,novel electrolyte and modular integration),mechanical resilience that includes various feats of flexibility or stretchability,and response to stimuli(self-healing,electrochromic,photo-responsive,or thermal-responsive properties).Furthermore,three representative integrated microsystems including energy harvester-PMSC,PMSC-energy consumption,and all-in-one selfpowered microsystems are elaborately overviewed to understand the emerging intelligent interaction models.Finally,the key perspectives,challenges and opportunities of PMSCs for powering smart microelectronics are proposed in brief.展开更多
The rapid progress of micro/nanoelectronic systems and miniaturized portable devices has tremendously increased the urgent demands for miniaturized and integrated power supplies.Miniaturized energy storage devices(MES...The rapid progress of micro/nanoelectronic systems and miniaturized portable devices has tremendously increased the urgent demands for miniaturized and integrated power supplies.Miniaturized energy storage devices(MESDs),with their excellent properties and additional intelligent functions,are considered to be the preferable energy supplies for uninterrupted powering of microsystems.In this review,we aim to provide a comprehensive overview of the background,fundamentals,device configurations,manufacturing processes,and typical applications of MESDs,including their recent advances.Particular attention is paid to advanced device configurations,such as two-dimensional(2D)stacked,2D planar interdigital,2D arbitrary-shaped,three-dimensional planar,and wire-shaped structures,and their corresponding manufacturing strategies,such as printing,scribing,and masking techniques.Additionally,recent developments in MESDs,including microbatteries and microsupercapacitors,as well as microhybrid metal ion capacitors,are systematically summarized.A series of on-chip microsystems,created by integrating functional MESDs,are also highlighted.Finally,the remaining challenges and future research scope on MESDs are discussed.展开更多
Ambient suspended particulate matter(PM)(primarily with particle diameter 2.5m or less,i.e.,PM2.5)can adversely affect ecosystems and human health.Currently,optical particle sensors based on light scattering dominate...Ambient suspended particulate matter(PM)(primarily with particle diameter 2.5m or less,i.e.,PM2.5)can adversely affect ecosystems and human health.Currently,optical particle sensors based on light scattering dominate the portable PM sensing market.However,the light scattering method has poor adaptability to different-sized PM and adverse environmental conditions.Here,we design and develop a portable PM sensing microsystem that consists of a micromachined virtual impactor(VI)for particle separation,a thermophoretic deposition chip for particle collection,and an extended-gate field-effect transistor(FET)for particle analysis.This system can realize on-site separation,collection,and analysis of aerosol particles without being influenced by environmental factors.In this study,the design of the VI is thoroughly analyzed by numerical simulation,and mixtures of different-sized silicon dioxide(SiO2)particles are used in an experimental verification of the performance of the VI and FET.Considering the low cost and compact design of the whole system,the proposed PM analysis microsystem has potential for PM detection under a wide range of conditions,such as heavily polluted industrial environments and for point-of-need outdoor and indoor air quality monitoring.展开更多
This paper presents a method for designing a class of countermeasures for DPA attacks based on attenuation of current variations. In this class of countermeasures, designers aim at decreasing the dynamic current varia...This paper presents a method for designing a class of countermeasures for DPA attacks based on attenuation of current variations. In this class of countermeasures, designers aim at decreasing the dynamic current variations to reduce the information that can be extracted from the current consumption of secure microsystems. The proposed method is based on a novel formula that calculates the number of current traces required for a successful DPA attack using the characteristics of the microsystem current signal and the external noise of the measurement setup. The different stages of the proposed method are illustrated through designing an example current flattening circuit. Meanwhile validity and applicability of the proposed formula is verified by comparing theoretical results with those obtained experimentally for the example circuit. The proposed formula not only estimates the required level of attenuation for a target level of robustness defined by design requirements, it also predicts the effectiveness of a countermeasure using simulation results therefore dramatically reducing the time to design of secure microsystems.展开更多
JK Microsystems公司推出一种嵌入式功率控制器，把调整，监视和开/关控制安装在比信用卡还要小的平台中。这种PowerNut电源管理板把输入功率控制在现有的器件上，从而简化了电源设计。该板给设计者提供一种包括电压调整，电源开／关时...JK Microsystems公司推出一种嵌入式功率控制器，把调整，监视和开/关控制安装在比信用卡还要小的平台中。这种PowerNut电源管理板把输入功率控制在现有的器件上，从而简化了电源设计。该板给设计者提供一种包括电压调整，电源开／关时间表和电压监视的现成解决方案。从太阳能板或电池传来的电源电压能控制输出1A的电流。展开更多
A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna arra...A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna array is realized.Then the low power devices such as through silicon via(TSV)transfer chips,filters and antenna tuners are flip-welded on the glass wafer,and the glass wafer is reformed into a wafer permanently bonded with glass and resin by the injection molding process with resin material.Finally,the thinning resin surface leaks out of the TSV transfer chip,the rewiring is carried out on the resin surface,and then the power amplifier,low-noise amplifier,power management and other devices are flip-welded on the resin wafer surface.A ball grid array(BGA)is implanted to form the final package.The loss of the RF transmission line is measured by using the RF millimeter wave probe table.The results show that the RF transmission loss from the chip end to the antenna end in the fan-out package is very small,and it is only 0.26 dB/mm when working in 60 GHz.A slot coupling antenna is designed on the glass wafer.The antenna can operate at 60 GHz and the maximum gain can reach 6 dB within the working bandwidth.This demonstration successfully provides a feasible solution for the 3D fan-out integration of RF microsystem and antenna in 5G communications.展开更多
Wireless power transmission based on inductive coupling for remotely implanted micro devices has been considered in this paper. The receiving coil, integrated in microsystems and the external transmitting coil compose...Wireless power transmission based on inductive coupling for remotely implanted micro devices has been considered in this paper. The receiving coil, integrated in microsystems and the external transmitting coil compose a loosely coupled transformer. The coupling coefficient was calculated and measured on spacing misalignments. The geometric size of transmitting coil was analyzed for the target of remotely delivering power. The received power was maximized by choosing appropriate value of frequency, tuning capacitance and the load resistance. A conventional full bridge rectifier circuit was employed to convert ac to dc voltage. The received dc power was up to 160 mW with a transmitting voltage of 5 Vrms when the receiving coil was placed at the center of the transmitting coil. This may meet the requirement of some microsystems for high power over a long time.展开更多
In the post-Moore era,the development of active phased array antennas will inevitably trend towards active array microsystems.In this paper,the characteristics and composition of the active array antenna are briefly d...In the post-Moore era,the development of active phased array antennas will inevitably trend towards active array microsystems.In this paper,the characteristics and composition of the active array antenna are briefly described.Owing to the high efficiency,low profile,and light weight of the active array microsystems,the application prospects and advantages in the engineering of multi-functional airborne radar,spaceborne radar,and communication systems are analyzed.Moreover,according to the characteristics of the post-Moore era of integrated circuits,scientific and technological problems in the active array microsystems are presented,including multi-scale,multi-signal,and multi-physics field coupling.The challenges are also discussed,such as new architectures and algorithms,miniaturization of passive components,novel materials and processes,ultra-wideband technology,and new interdisciplinary technological applications.This paper is expected to inspire in-depth research on active array microsystems.展开更多
The escalating demand for micro/nano-sized devices,such as micro/nano-robots,intelligent portable/wearable microsystems,and implantable medical microdevices,necessitates the expeditious development of integrated micro...The escalating demand for micro/nano-sized devices,such as micro/nano-robots,intelligent portable/wearable microsystems,and implantable medical microdevices,necessitates the expeditious development of integrated microsystems incorporating energy conversion,storage,and consumption.Critical bottlenecks in microscale energy storage/sensors and their integrated systems are being addressed by exploring new technologies and new materials,e.g.,MXene,holding great potential for developing lightweight and deformable integrated microdevices.This review summarizes the latest progress and milestones in the realization of MXene-based micro-supercapacitors(MSCs)and sensor arrays,and thus discusses the design fundamentals and key advancements of MXene-based energy conversion-storageconsumption integrated microsystems.Finally,we outline the key challenges in fabricating MXenebased MSCs/sensors and their self-powered integrated microsystems,which is crucial for their practical applications.Particularly,we illuminate viable solutions to such unsolved issues and highlight the exciting opportunities.展开更多
基金the National Natural Science Foundation of China,China (Grant Nos.22125903,51872283,22109040)the“Transformational Technologies for Clean Energy and Demonstration”Strategic Priority Research Program of the Chinese Academy of Sciences (Grant No.XDA21000000)+4 种基金the Dalian Innovation Support Plan for High Level Talents,China (2019RT09)DICP,China (DICP I202032)the Dalian National Laboratory For Clean Energy (DNL),CAS,DNL Cooperation Fund,CAS,China (DNL202016,DNL202019)the Top-Notch Talent Program of Henan Agricultural University,China (30500947)the Joint Fund of the Yulin University and the Dalian National Laboratory for Clean Energy,China (YLU-DNL Fund 2021002,YLU-DNL Fund 2021009)。
文摘The popularization of portable,implantable and wearable microelectronics has greatly stimulated the rapid development of high-power planar micro-supercapacitors(PMSCs).Particularly,the introduction of new functionalities(e.g.,high voltage,flexibility,stretchability,self-healing,electrochromism and photo/thermal response)to PMSCs is essential for building multifunctional PMSCs and their smart selfpowered integrated microsystems.In this review,we summarized the latest advances in PMSCs from various functional microdevices to their smart integrated microsystems.Primarily,the functionalities of PMSCs are characterized by three major factors to emphasize their electrochemical behavior and unique scope of application.These include but are not limited to high-voltage outputs(realized through asymmetric configuration,novel electrolyte and modular integration),mechanical resilience that includes various feats of flexibility or stretchability,and response to stimuli(self-healing,electrochromic,photo-responsive,or thermal-responsive properties).Furthermore,three representative integrated microsystems including energy harvester-PMSC,PMSC-energy consumption,and all-in-one selfpowered microsystems are elaborately overviewed to understand the emerging intelligent interaction models.Finally,the key perspectives,challenges and opportunities of PMSCs for powering smart microelectronics are proposed in brief.
基金the financial support from the National Natural Science Foundation of China(Grant Nos.51702095,51722503,51975204)Natural Science Foundation of Hunan Province,China(Grant No.2018JJ3041)+1 种基金the Fundamental Research Funds for the Central Universities(531118010016)Science and Technology Bureau Foundation of Changsha City(kh1904005)。
文摘The rapid progress of micro/nanoelectronic systems and miniaturized portable devices has tremendously increased the urgent demands for miniaturized and integrated power supplies.Miniaturized energy storage devices(MESDs),with their excellent properties and additional intelligent functions,are considered to be the preferable energy supplies for uninterrupted powering of microsystems.In this review,we aim to provide a comprehensive overview of the background,fundamentals,device configurations,manufacturing processes,and typical applications of MESDs,including their recent advances.Particular attention is paid to advanced device configurations,such as two-dimensional(2D)stacked,2D planar interdigital,2D arbitrary-shaped,three-dimensional planar,and wire-shaped structures,and their corresponding manufacturing strategies,such as printing,scribing,and masking techniques.Additionally,recent developments in MESDs,including microbatteries and microsupercapacitors,as well as microhybrid metal ion capacitors,are systematically summarized.A series of on-chip microsystems,created by integrating functional MESDs,are also highlighted.Finally,the remaining challenges and future research scope on MESDs are discussed.
基金supported by the National Natural Science Foundation of China(Nos.91743110,61674114,and 21861132001)the National Key R&D Program of China(Nos.2017YFF0204604 and 2018YFE0118700)+1 种基金Tianjin Applied Basic Research and Advanced Technology(No.17JCJQJC43600),the“111”Project(No.B07014)the Foundation for Talent Scientists of Nanchang Institute for Micro-technology of Tianjin University.
文摘Ambient suspended particulate matter(PM)(primarily with particle diameter 2.5m or less,i.e.,PM2.5)can adversely affect ecosystems and human health.Currently,optical particle sensors based on light scattering dominate the portable PM sensing market.However,the light scattering method has poor adaptability to different-sized PM and adverse environmental conditions.Here,we design and develop a portable PM sensing microsystem that consists of a micromachined virtual impactor(VI)for particle separation,a thermophoretic deposition chip for particle collection,and an extended-gate field-effect transistor(FET)for particle analysis.This system can realize on-site separation,collection,and analysis of aerosol particles without being influenced by environmental factors.In this study,the design of the VI is thoroughly analyzed by numerical simulation,and mixtures of different-sized silicon dioxide(SiO2)particles are used in an experimental verification of the performance of the VI and FET.Considering the low cost and compact design of the whole system,the proposed PM analysis microsystem has potential for PM detection under a wide range of conditions,such as heavily polluted industrial environments and for point-of-need outdoor and indoor air quality monitoring.
文摘This paper presents a method for designing a class of countermeasures for DPA attacks based on attenuation of current variations. In this class of countermeasures, designers aim at decreasing the dynamic current variations to reduce the information that can be extracted from the current consumption of secure microsystems. The proposed method is based on a novel formula that calculates the number of current traces required for a successful DPA attack using the characteristics of the microsystem current signal and the external noise of the measurement setup. The different stages of the proposed method are illustrated through designing an example current flattening circuit. Meanwhile validity and applicability of the proposed formula is verified by comparing theoretical results with those obtained experimentally for the example circuit. The proposed formula not only estimates the required level of attenuation for a target level of robustness defined by design requirements, it also predicts the effectiveness of a countermeasure using simulation results therefore dramatically reducing the time to design of secure microsystems.
文摘A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna array is realized.Then the low power devices such as through silicon via(TSV)transfer chips,filters and antenna tuners are flip-welded on the glass wafer,and the glass wafer is reformed into a wafer permanently bonded with glass and resin by the injection molding process with resin material.Finally,the thinning resin surface leaks out of the TSV transfer chip,the rewiring is carried out on the resin surface,and then the power amplifier,low-noise amplifier,power management and other devices are flip-welded on the resin wafer surface.A ball grid array(BGA)is implanted to form the final package.The loss of the RF transmission line is measured by using the RF millimeter wave probe table.The results show that the RF transmission loss from the chip end to the antenna end in the fan-out package is very small,and it is only 0.26 dB/mm when working in 60 GHz.A slot coupling antenna is designed on the glass wafer.The antenna can operate at 60 GHz and the maximum gain can reach 6 dB within the working bandwidth.This demonstration successfully provides a feasible solution for the 3D fan-out integration of RF microsystem and antenna in 5G communications.
基金National High Technology Research and Development Program of China(863 Program),Grant number:2004AA404013.
文摘Wireless power transmission based on inductive coupling for remotely implanted micro devices has been considered in this paper. The receiving coil, integrated in microsystems and the external transmitting coil compose a loosely coupled transformer. The coupling coefficient was calculated and measured on spacing misalignments. The geometric size of transmitting coil was analyzed for the target of remotely delivering power. The received power was maximized by choosing appropriate value of frequency, tuning capacitance and the load resistance. A conventional full bridge rectifier circuit was employed to convert ac to dc voltage. The received dc power was up to 160 mW with a transmitting voltage of 5 Vrms when the receiving coil was placed at the center of the transmitting coil. This may meet the requirement of some microsystems for high power over a long time.
基金Project supported by the National Natural Science Foundation of China(No.92373115)the Natural Science Foundation of Anhui Province,China(No.2308085MF193)+2 种基金the Major Natural Science Project of Anhui Provincial Education Department,China(No.KJ2021ZD0003)the Key Research and Development Project of Anhui Province,China(No.2023n06020026)the Innovation and Entrepreneurship of Anhui Province,China(No.Z020118060)。
文摘In the post-Moore era,the development of active phased array antennas will inevitably trend towards active array microsystems.In this paper,the characteristics and composition of the active array antenna are briefly described.Owing to the high efficiency,low profile,and light weight of the active array microsystems,the application prospects and advantages in the engineering of multi-functional airborne radar,spaceborne radar,and communication systems are analyzed.Moreover,according to the characteristics of the post-Moore era of integrated circuits,scientific and technological problems in the active array microsystems are presented,including multi-scale,multi-signal,and multi-physics field coupling.The challenges are also discussed,such as new architectures and algorithms,miniaturization of passive components,novel materials and processes,ultra-wideband technology,and new interdisciplinary technological applications.This paper is expected to inspire in-depth research on active array microsystems.
文摘The escalating demand for micro/nano-sized devices,such as micro/nano-robots,intelligent portable/wearable microsystems,and implantable medical microdevices,necessitates the expeditious development of integrated microsystems incorporating energy conversion,storage,and consumption.Critical bottlenecks in microscale energy storage/sensors and their integrated systems are being addressed by exploring new technologies and new materials,e.g.,MXene,holding great potential for developing lightweight and deformable integrated microdevices.This review summarizes the latest progress and milestones in the realization of MXene-based micro-supercapacitors(MSCs)and sensor arrays,and thus discusses the design fundamentals and key advancements of MXene-based energy conversion-storageconsumption integrated microsystems.Finally,we outline the key challenges in fabricating MXenebased MSCs/sensors and their self-powered integrated microsystems,which is crucial for their practical applications.Particularly,we illuminate viable solutions to such unsolved issues and highlight the exciting opportunities.
