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100-112 Gbit/s complete ETDM systems based on monolithically integrated transmitter and receiver modules
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作者 王轲 李杰 +14 位作者 Anders Djupsjbacka Marek Chaciński Urban Westergren Sergei Popov Gunnar Jacobsen Volker Hurm Robert Elvis Makon Rachid Driad Herbert Walcher Josef Rosenzweig Andreas G.Steffan G.Giorgis Mekonnen Heinz-Gunter Bach 李卓 Ari T.Friberg 《Journal of Beijing Institute of Technology》 EI CAS 2011年第3期410-414,共5页
Traditional intensity modulated two-level electrical time-division multiplexing (ETDM) transmission systems working at 100 -112 Gbit/s were investigated. The complete ETDM systems based on monolithically integrated ... Traditional intensity modulated two-level electrical time-division multiplexing (ETDM) transmission systems working at 100 -112 Gbit/s were investigated. The complete ETDM systems based on monolithically integrated transmitter and receiver modules were demonstrated with biterror-rate (BER) performance of 10-s at 107 Gbit/s, and near error-free standard forward error correction (FEC) threshold (2 × 10 -3) at 112 Gbit/s. The experiment results showed that directly modulated high-speed ETDM transmission systems with the symbol rates at 100 Gbaud and beyond were promising candidate for cost-effective 100 GbE applications and might be a preform of the next generation of Terabit/s Ethernet. 展开更多
关键词 100 Gigabit Ethernet (GbE) BIT-ERROR-RATE Eye-diagram electrical time-division multiplexing (ETDM) system MODULES
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Densification of Thin Aluminum Oxide Films by Thermal Treatments
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作者 V. Cimalla M. Baeumler +9 位作者 L. Kirste M. Prescher B. Christian T. Passow F. Benkhelifa F. Bernhardt G. Eichapfel M. Himmerlich S. Krischok J. Pezoldt 《Materials Sciences and Applications》 2014年第8期628-638,共11页
Thin AlOx films were grown on 4H-SiC by plasma-assisted atomic layer deposition (ALD) and plasma assisted electron-beam evaporation at 300°C. After deposition, the films were annealed in nitrogen at temperatures ... Thin AlOx films were grown on 4H-SiC by plasma-assisted atomic layer deposition (ALD) and plasma assisted electron-beam evaporation at 300°C. After deposition, the films were annealed in nitrogen at temperatures between 500°C and 1050°C. The films were analyzed by X-ray reflectivity (XRR) and atomic force microscopy (AFM) in order to determine film thickness, surface roughness and density of the AlOx layer. No differences were found in the behavior of AlOx films upon annealing for the two different employed deposition techniques. Annealing results in film densification, which is most prominent above the crystallization temperature (800°C). In addition to the increasing density, a mass loss of ~5% was determined and attributed to the presence of aluminum oxyhydroxide in as deposited films. All changes in film properties after high temperature annealing appear to be independent of the deposition technique. 展开更多
关键词 ATOMIC Layer DEPOSITION CRYSTALLIZATION Thermal Treatment Aluminum OXIDE
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德国AIM公司三代红外探测器的发展
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作者 J. Zieglerl D. Eich +11 位作者 M. Mahlein T. Schallenberg R. Scheibner J. Wendler J. Wenisch R.Wollrab V. Daumer R. Rehm F. Rutz M. Walther 田萦(译) 王忆锋(校对) 《云光技术》 2012年第2期37-48,共12页
三代红外探测器组件——双色(DC),双波段(DB)以及大规模2-DY0阵要求精细的生产技术:诸如分子束外延(MBE)以及新的列阵制备工艺,此类技术可以满足日趋复杂的器件结构及低成本的需求。AIM公司将采用上述三种技术制备高性能器件... 三代红外探测器组件——双色(DC),双波段(DB)以及大规模2-DY0阵要求精细的生产技术:诸如分子束外延(MBE)以及新的列阵制备工艺,此类技术可以满足日趋复杂的器件结构及低成本的需求。AIM公司将采用上述三种技术制备高性能器件以扩大其未来的业务。DC/MW/MW探测器基于II-型超晶格锑化物(IAF通过MBE技术制备而成),像元规格为384×288,像元中心距为40μm。AIM公司的DB/MW/LW/FPA(焦平面列阵)选用了MBE技术,通过在CdZnTe衬底上生长MCT,该技术与IAF公司合作完成。由AIM公司制备了像元规格为640×512,像元中心距为15μm的FPA。尽管在不同的衬底上用MBE方法生长MW/MCT薄膜具有挑战性,但对于制备具备百万像素的大规模2维FPA(MW1280×1024,像元中心距为15μm)而言,这种技术是必要的。本文给出了上述三代FPA及集成探测器杜瓦制冷机组件(IDCAs)的发展现状及近期测试结果。 展开更多
关键词 红外探测器 三代探测器 HGCDTE MCT 双色 双波段 MW/LW 百万像素 MBE II-型超晶格锑化物 T2SL
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Superconducting single-photon detectors integrated with diamond nanophotonic circuits 被引量:5
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作者 Patrik Rath Oliver Kahl +7 位作者 Simone Ferrari Fabian Sproll Georgia Lewes-Malandrakis Dietmar Brink Konstantin Ilin Michael Siegel Christoph Nebel Wolfram Pernice 《Light(Science & Applications)》 SCIE EI CAS CSCD 2015年第1期171-178,共8页
Photonic quantum technologies hold promise to repeat the success of integrated nanophotonic circuits in non-classical applications.Using linear optical elements,quantum optical computations can be performed with integ... Photonic quantum technologies hold promise to repeat the success of integrated nanophotonic circuits in non-classical applications.Using linear optical elements,quantum optical computations can be performed with integrated optical circuits and can therefore overcome the existing limitations in terms of scalability.In addition to passive optical devices for realizing photonic quantum gates,active elements,such as single-photon sources and single-photon detectors,are essential ingredients for future optical quantum circuits.Material systems that allow for the monolithic integration of all components are particularly attractive,including III-V semiconductors,silicon and diamond.Here,we demonstrate nanophotonic integrated circuits made from high-quality polycrystalline diamond thin films in combination with on-chip single-photon detectors.By using superconducting nanowires that are coupled evanescently to traveling waves,we achieve high detection efficiencies of up to 66%as well as low dark count rates and a timing resolution of 190 ps.Our devices are fully scalable and hold promise for functional diamond photonic quantum devices. 展开更多
关键词 diamond nanophotonics integrated optics superconducting single-photon detectors
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