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Highly Thermally Conductive and Structurally Ultra‑Stable Graphitic Films with Seamless Heterointerfaces for Extreme Thermal Management
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作者 Peijuan Zhang Yuanyuan Hao +17 位作者 Hang Shi Jiahao Lu Yingjun Liu Xin Ming Ya Wang Wenzhang Fang Yuxing Xia Yance Chen Peng Li Ziqiu Wang Qingyun Su Weidong Lv Ji Zhou Ying Zhang Haiwen Lai Weiwei Gao Zhen Xu Chao Gao 《Nano-Micro Letters》 SCIE EI CSCD 2024年第3期383-397,共15页
Highly thermally conductive graphitic film(GF)materials have become a competitive solution for the thermal management of high-power electronic devices.However,their catastrophic structural failure under extreme altern... Highly thermally conductive graphitic film(GF)materials have become a competitive solution for the thermal management of high-power electronic devices.However,their catastrophic structural failure under extreme alternating thermal/cold shock poses a significant challenge to reliability and safety.Here,we present the first investigation into the structural failure mechanism of GF during cyclic liquid nitrogen shocks(LNS),which reveals a bubbling process characterized by“permeation-diffusion-deformation”phenomenon.To overcome this long-standing structural weakness,a novel metal-nanoarmor strategy is proposed to construct a Cu-modified graphitic film(GF@Cu)with seamless heterointerface.This well-designed interface ensures superior structural stability for GF@Cu after hundreds of LNS cycles from 77 to 300 K.Moreover,GF@Cu maintains high thermal conductivity up to 1088 W m^(−1)K^(−1)with degradation of less than 5%even after 150 LNS cycles,superior to that of pure GF(50%degradation).Our work not only offers an opportunity to improve the robustness of graphitic films by the rational structural design but also facilitates the applications of thermally conductive carbon-based materials for future extreme thermal management in complex aerospace electronics. 展开更多
关键词 Highly thermally conductive Structurally ultra-stable Graphitic film Extreme thermal management Liquid nitrogen bubbling
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Flexible Large-Area Graphene Films of 50-600 nm Thickness with High Carrier Mobility 被引量:1
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作者 Shiyu Luo Li Peng +13 位作者 Yangsu Xie Xiaoxue Cao Xiao Wang Xiaoting Liu Tingting Chen Zhanpo Han Peidong Fan Haiyan Sun Ying Shen Fan Guo Yuxing Xia Kaiwen Li Xin Ming Chao Gao 《Nano-Micro Letters》 SCIE EI CAS CSCD 2023年第5期1-14,共14页
Bulk graphene nanofilms feature fast electronic and phonon transport in combination with strong light-matter interaction and thus have great potential for versatile applications,spanning from photonic,electronic,and o... Bulk graphene nanofilms feature fast electronic and phonon transport in combination with strong light-matter interaction and thus have great potential for versatile applications,spanning from photonic,electronic,and optoelectronic devices to charge-stripping and electromagnetic shielding,etc.However,large-area flexible close-stacked graphene nanofilms with a wide thickness range have yet to be reported.Here,we report a polyacrylonitrile-assisted’substrate replacement’strategy to fabricate large-area free-standing graphene oxide/polyacrylonitrile nanofilms(lateral size~20 cm).Linear polyacrylonitrile chains-derived nanochannels promote the escape of gases and enable macro-assembled graphene nanofilms(nMAGs)of 50-600 nm thickness following heat treatment at 3,000℃.The uniform nMAGs exhibit 802-1,540 cm^(2)V-1s-1carrier mobility,4.3-4.7 ps carrier lifetime,and>1,581 W m^(-1)K^(-1)thermal conductivity(n MAG-assembled 10μm-thick films,mMAGs).nMAGs are highly flexible and show no structure damage even after 1.0×10^(5)cycles of folding-unfolding.Furthermore,n MAGs broaden the detection region of graphene/silicon heterojunction from near-infrared to mid-infrared and demonstrate higher absolute electromagnetic interference(EMI)shielding effectiveness than state-of-the-art EMI materials of the same thickness.These results are expected to lead to the broad applications of such bulk nanofilms,especially as micro/nanoelectronic and optoelectronic platforms. 展开更多
关键词 Flexible large-area graphene nanofilm High carrier mobility Mid-infrared detection Electromagnetic interference shielding Heat transfer
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