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Bi-Cu film deposition in aqueous solutions
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作者 Hitoshi WADA Yasuhiro NISHISAKA +1 位作者 Ryoichi ICHINO Masazumi OKIDO 《中国有色金属学会会刊:英文版》 EI CSCD 2009年第4期791-794,共4页
The relatively uniform bismuth-copper film was electrodeposited between -15 and -20 mV in the sulfate electrolyte containing 4 mmol/L bismuth ion and 2 mmol/L copper ion.Only copper was electrodeposited at -5 mV.The d... The relatively uniform bismuth-copper film was electrodeposited between -15 and -20 mV in the sulfate electrolyte containing 4 mmol/L bismuth ion and 2 mmol/L copper ion.Only copper was electrodeposited at -5 mV.The dendritic bismuth-copper film was electrodeposited under -20 mV.The cathodic current became constant between -20 and -400 mV.Therefore,bismuth-copper electrodeposition changes from charge transfer controlling to diffusion controlling at -20 mV.On the other hand,the uniform bismuth-copper film was electrodeposited between -5 and -35 mV in the methanesulfonate electrolyte containing 4 mmol/L bismuth ion and 2 mmol/L copper ion.The dendritic bismuth-copper film was electrodeposited under -35 mV.The potential region for good electrodepositon in methanesulfonate electrolyte is wider than that in sulfate electrolyte.Therefore,it is easy to control electrodeposition conditions by using methanesulfonate electrolyte. 展开更多
关键词 薄膜沉积 铜薄膜 水溶液 硫酸电解液 扩散控制 铋离子 电沉积 电解质
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